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In-Line Vacuum Sputtering Equipment
Industry type：Productivity and energy
Product model number：鈦銅種子層濺鍍機
UVAT Technology Co.,Ltd.
The metallization process in traditional semiconductor packaging is used chemical copper plating with copper electroplating. Due to the need for fine line, it has the problem of poor film adhesion, so the demand for titanium copper sputtering has arisen accordingly.
UVAT has long-term experience and technology in metal sputtering, including mechanical design, process parameters, and thin film performance development. The key technical modules of this product include high-temperature degas intelligent system, low-temperature of PVD intelligent monitoring system, pre-clean (pretreatment) system, particle suppression system, titanium copper sputtering technology and optimization of titanium copper process parameters. We have high-performance machine to enter into the fan-out wafer size packaging (FOWLP) market. The FOPLP has a significant benefit in reducing the process cost and increase using efficiency area by its large carrier area, which is the development trend of the FOPLP process.
About UVAT Technology Co.,Ltd.
Founded in 2002, UVAT is a group of specialists with years of experience in vacuum technology that are constantly engaged themselves in the design and development of Physical Vapor Deposition (PVD) and key coating machines. We provide sputtering equipment and coating OEM service. In addition to the coating on cell phone buttons/monitors, the vacuum film coating process and Non Conductive Vacuum Metallization (NCVM) specifically designed for RMI protection for laptop computers and cell phones are now available for the market. In addition to AR coating and other anti-finger print film coating services provided recently, we have developed the sputtering applications for solar panels and touch screens, and now customized process development and equipment manufacture are available as well.
UVAT’s enterprise purpose is to create green technology product to compatible with our environment so that our future generation can have a pollution-free environment .
Founded in 2002, UVAT’s general manager Jeff Lee takes a group of specialists with years of experience in vacuum technology that are constantly engaged themselves in the design and development of vacuum sputtering technology. Our goal is to produce green technology product so as to replace polluted electroplating. We are developing environmental protection technology to make our product with low noise, low pollution and energy saving. We also provide customized product to meet our customer’s expectations.
In order to produce no pollution process of vacuum sputtering products, we use Unique, Vacuum, Technology as our brand name. UVAT's development process has been continuously improved through technology innovation. We has extended vacuum sputtering technology to 5G optical application sputtering and advanced semiconductor packaging processes as well as coreless Ti/Cu sputtering and vacuum plasma etching applications. In the future, we will continue to uphold the concept of professional integrity, continue to innovate and improve, and move towards the world's first-class professional vacuum sputtering technology.
Contact info
Tel：04-25653755
Email：PR@uvat.com
Tel：03-2126201#102
Fax：03-2126202#102
Email：PR@uvat.com
