The features of the KINIK reclaimed wafers are refurbished by ductile mode grinding used to replace traditional lapping to lower the strained thickness on the surface and chemical contamination. The ductile mode grinding is the leading-edge process for the high precious reclaimed wafers.
Invest in the development of next-generation processes in a timely manner in line with customers' product line width reduction and process
requirements. Actively apply core technology to high value-added hard and brittle material products in other semiconductor industries to increase
product breadth and scale of operation; on the other hand, accelerate capacity expansion and quality improvement in response to the increasing
demand for 12-inch wafer regeneration from domestic and foreign customers.